Migration of Low Angle Grain Boundaries during Secondary Recrystallisation in Silicon Steel Sheet
نویسندگان
چکیده
منابع مشابه
Stress-driven migration of simple low-angle mixed grain boundaries
We investigated the stress-induced migration of a class of simple low-angle mixed grain boundaries (LAMGBs) using a combination of discrete dislocation dynamics simulations and analytical arguments. The migration of LAMGBs under an externally applied stress can occur by dislocation glide, and was observed to be coupled to the motion parallel to the boundary plane, i.e. tangential motion. Both t...
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Institut für Metallkunde und Metallphysik, RWTH Aachen, 52056 Aachen, Germany Carnegie Mellon University, Pittsburgh PA 15213, USA Abstract The migration of planar, symmetric tilt grain boundaries with different tilt axes was investigated. The driving force for the grain boundary migration was due to an external mechanical stress field. Low as well as high angle grain boundaries can move under ...
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Secondary recrystallization id grain-oriented silicon steel is studied by the high-temperature background damping. Abnormal grain growth involves an abrupt drop of the background. The temperatures of initiation and completion of the secondary recrystallization are, thus, determined for the sane sample from the definite change in background with increasing temperature. The background measured on...
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ژورنال
عنوان ژورنال: Tetsu-to-Hagane
سال: 2003
ISSN: 0021-1575,1883-2954
DOI: 10.2355/tetsutohagane1955.89.10_1044